AMAOE PD-C BGA reballing platform
$39.99
Description
AMAOE PD-C Magnetic BGA Reballing Platform
A professional universal planting tin and BGA reballing platform designed for
precision CPU and IC rework. The AMAOE PD-C combines a magnetic positioning
system with a heat-resistant silicone work surface to help technicians align,
secure, and reball chips with greater control during microsoldering and board-level repair.
Component Positioning
BGA Rework Platform
Heat-Resistant Surface
CPU / IC Rework
Precision Platform for BGA Reballing & IC Rework
The AMAOE PD-C Magnetic BGA Reballing Platform is built for technicians
performing detailed board-level work including CPU reballing, IC rework, solder-ball
planting, chip positioning, and microsoldering preparation.
Its magnetic positioning design helps keep small components and reballing fixtures
stable while you work, reducing unwanted movement during stencil alignment and solder
ball application.
- Designed for professional BGA and IC rework.
- Magnetic positioning helps secure chips and fixtures.
- Heat-resistant silicone working surface.
- Suitable for CPU, NAND, baseband, power IC, and other BGA components.
- Useful for smartphone, tablet, and logic-board microsoldering work.
- Compact bench tool for professional repair environments.
Designed for Microsoldering Technicians
Magnetic Positioning
The magnetic platform helps hold compatible fixtures, chips, and positioning
pieces securely while preparing components for reballing or rework.
Precision BGA Work
Ideal for delicate BGA operations where accurate chip positioning and stencil
alignment are important for consistent solder-ball placement.
Heat-Resistant Silicone
The silicone work area provides a practical surface for electronics repair and
helps protect your bench while handling components during soldering preparation.
Universal Repair Bench Tool
Useful beyond one specific phone model, making it a practical addition to a
professional microsoldering, reballing, or logic-board repair workstation.
Built for Advanced Board-Level Repair
BGA rework requires precise alignment. Even slight movement during solder-ball
planting can produce uneven joints, bridges, or missing connections.
The AMAOE PD-C platform gives technicians a stable working area for handling
CPU, memory, NAND, baseband, power-management, and other BGA ICs
during reballing and rework procedures.
Compatible Repair Applications
This is a professional board-level repair tool intended for technicians experienced
with BGA rework, hot-air soldering, stencil alignment, solder paste or solder-ball
application, and microsoldering procedures.
Useful for CPU & IC Reballing
When removing or reinstalling a BGA component, the original solder balls often need
to be replaced before the chip can be installed again.
A stable reballing platform helps keep the component properly positioned while a
stencil is aligned and solder balls or solder paste are applied.
This makes the AMAOE PD-C useful for advanced repairs involving:
- CPU reballing and replacement.
- NAND memory rework.
- Baseband IC repair.
- Power-management IC replacement.
- Charging-controller IC rework.
- Audio and communication IC reballing.
- Logic-board component restoration.
Professional Repair Bench Accessory
Whether you operate a repair shop or maintain your own microsoldering workstation,
the AMAOE PD-C provides a dedicated surface for precision BGA work without taking up
excessive bench space.
It pairs naturally with common microsoldering equipment such as:
- BGA reballing stencils.
- Solder balls and solder paste.
- Hot-air rework stations.
- Microscopes.
- Precision tweezers.
- Flux and soldering accessories.
- PCB and IC holders.
Product Features
- AMAOE PD-C BGA reballing platform.
- Universal magnetic positioning design.
- Designed for planting tin and solder-ball rework.
- Heat-resistant silicone working surface.
- Suitable for smartphone CPU and IC repair.
- Designed for iPhone 6 through iPhone 15 generation rework applications.
- Useful for CPU, NAND, baseband, PMIC, and other BGA components.
- Compact design for professional repair benches.
- Suitable for microsoldering and board-level electronics repair.
Precision Starts With a Stable Work Surface.
Make CPU and BGA reballing easier to control with a dedicated magnetic platform
designed for professional microsoldering and IC rework.
Trílex Fix Repair Group LLC
